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Chip designer Broadcom has raised concerns about supply chain constraints within the technology sector, attributing part of the issue to capacity limitations at its manufacturing partner TSMC. Natarajan Ramachandran, director of product marketing in Broadcom’s Physical Layer Products division, noted that TSMC’s capacity, previously seen as virtually limitless, has become a bottleneck impacting the supply chain in 2026.
In response to the soaring demand for AI chips, TSMC, a key producer of advanced AI chips globally, acknowledged tight production capacity earlier this year. The company is working to bridge the supply-demand gap, particularly with major clients like Nvidia and Apple.
Ramachandran highlighted that supply shortages extend beyond semiconductors, affecting various adjacent supply chains. Issues in the laser space and delays in printed circuit board (PCB) production have been particularly notable, with lead times for PCBs used in optical transceivers stretching from six weeks to six months.
The industry trend towards securing long-term capacity commitments is evident, with customers entering agreements lasting three to four years to ensure a stable supply chain. Samsung Electronics, a prominent memory chipmaker, recently announced plans to shift towards longer-term contracts with major customers.
Source: Tech-Economic Times