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Broadcom, a leading chip designer, is poised to sell 1 million 3D stacked chips by 2027, showcasing a significant advancement in hardware technology. Over the past five years, Broadcom has refined this innovative technology, culminating in Fujitsu becoming its first customer. Fujitsu is currently in the process of testing engineering samples to validate the design, with plans to commence production of the stacked chips later this year.
3D stacked chips represent a cutting-edge approach that allows for enhanced performance and efficiency in semiconductor devices. This development underscores Broadcom’s commitment to pushing the boundaries of hardware innovation and meeting the evolving demands of the tech industry.
Source: Tech-Economic Times